-

Faraday Unveils FlashKit™-22RRAM: An eNVM-Based SoC Development Platform for IoT

HSINCHU, Taiwan--(BUSINESS WIRE)--Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today introduced its latest FlashKit™ development platform, FlashKit™-22RRAM, designed to accelerate high-performance IoT and MCU applications. Built on UMC’s 22ULP process, FlashKit™-22RRAM combines embedded Resistive RAM (RRAM, ReRAM) technology with a rich IP ecosystem and development-ready support, providing a cost-effective and power-efficient SoC solution for edge devices.

Accelerate IoT and MCU SoC design and launch faster with FlashKit™-22RRAM

Share

The FlashKit™-22RRAM platform integrates a full-featured RRAM subsystem with DWORD access, delivering comparable performance with SST eFlash. This solution minimizes extra-mask requirements, making it highly suitable for consumer-grade eNVM applications, such as AIoT, smart home, wearables, and portable devices. It is silicon proven and fully prepared to support customers' fast ramp-up to volume production on UMC’s 22ULP node.

FlashKit™-22RRAM supports embedded CPU options including ARM Cortex-M7 and VeeR EH1 RISC-V, and integrates a comprehensive set of integrated IPs such as USB 3.0 Type-C, GMAC, and PLL. A built-in RRAM controller with built-in self-test (BIST) ensures streamlined data access and high production reliability. In additional, embedded FPGA (eFPGA) block is included for enhanced design flexibility and enabling post-silicon logic change, ECO, or GPIO re-assignment.

“FlashKit™-22RRAM demonstrates Faraday’s continued commitment to delivering optimized platforms that reduce development effort and accelerate time-to-market,” said Flash Lin, COO of Faraday Technology. “Our customers now have a highly integrated and cost-efficient path to bring differentiated eNVM-based products to market quickly, with the flexibility to scale for future needs.”

About Faraday Technology Corporation
Faraday Technology Corporation (TWSE: 3035) is dedicated to the mission of benefiting humanity and upholding sustainable values in every IC it handles. The company offers a comprehensive range of ASIC solutions, including 2.5D/3D Advanced packaging, Arm Cortex-A, R, M, A720AE, Neoverse CSS integration and hardening, FPGA-Go-ASIC, and design implementation services. Furthermore, its extensive silicon IP portfolio encompasses a wide array of offerings, such as I/O, Cell Library, Memory Compiler, DDR/LPDDR, MIPI D-PHY, V-by-One, USB, Giga Ethernet, SATA, PCIe, and SerDes. For further information, visit www.faraday-tech.com or follow Faraday on LinkedIn.

Contacts

Press Contact
Evan Ke
+886.3.578.7888 ext. 88689
evan@faraday-tech.com

Faraday Technology Corporation

TSE:3035

Release Summary
Faraday Technology introduced its latest FlashKit™ development platform designed to accelerate high-performance IoT and MCU applications.
$Cashtags

Contacts

Press Contact
Evan Ke
+886.3.578.7888 ext. 88689
evan@faraday-tech.com

More News From Faraday Technology Corporation

Faraday Unveils HiSpeedKit™-HS Platform for High-speed Interface IP Verification in SoCs

HSINCHU, Taiwan--(BUSINESS WIRE)--Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announces the launch of its latest SoC platform, HiSpeedKit™-HS, designed to enhance and streamline the verification process for high-speed interface IP subsystems. The platform supports Faraday’s and third-party controller IP solutions, enabling comprehensive hardware and software verification through FPGA integrated with HiSpeedKit-HS. The HiSpeedKit-HS platform...

Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production

HSINCHU, Taiwan--(BUSINESS WIRE)--Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, and Kiwimoore, a global leader in AI networking full-stack interconnect products and solutions, announced today that their jointly developed 2.5D packaging platform has successfully entered the mass production stage. The one-stop advanced packaging platform and service developed through collaboration between Faraday and Kiwimoore, which incorporates Kiwimoore’s Chiplet i...

Faraday Unveils Advanced Packaging Coordinated Platform for Multi-Source Chiplets

HSINCHU, Taiwan--(BUSINESS WIRE)--Faraday (TWSE: 3035) today introduced its advanced packaging coordinated platform for the vertical disintegration of chiplets....
Back to Newsroom