SEMI-THERM and Future Facilities Announce New Data Center Track Featuring Jonathan Koomey and Bahgat Sammakia

Compelling sessions will address the impact of IT equipment thermal design on the performance of the modern data center

SAN JOSE, Calif.--()--Future Facilities North America (Future Facilities NA), provider of engineering simulation software for data center design and operational planning, and SEMI-THERM, an electronic components and systems show focused on thermal management, announced today the formation of a new set of sessions for the 2017 symposium: the Data Center Track. Held March 13-17, SEMI-THERM 33 will provide a forum for engineers, academics, and executives to learn, exchange ideas, and display the latest in thermal management techniques, products, and services.

“Future Facilities is proud to support a collaboration that’s fostering increased communication between currently integral but previously separate elements of data center performance at SEMI-THERM 33”

The Data Center Track of SEMI-THERM 33 will feature a diverse series of sessions dedicated to exploring the impact of IT equipment thermal design on data center performance. As they continue to evolve, challenges like capacity losses, energy inefficiency, loss of resilience and unnecessarily risky business goals are components of today’s data center environment that need additional attention. In collaboration with the Northern California AFCOM Chapter, SEMI-THERM and Future Facilities present this opportunity to view the worlds of IT thermal design and operational planning side-by-side. Primary topics covered by the Data Center Track include: Component Design, Data Center Operations, and Data Center Design. SEMI-THERM 33 will be held at the DoubleTree Hotel in San Jose, CA.

Jonathan G. Koomey, PhD and Bahgat Sammakia, PhD will deliver substantive addresses for the Data Center Track. Koomey, a researcher, author, lecturer, and entrepreneur who examines climate solutions and the energy and environmental effects of information technology, will open the Data Center Track on the evening of Tuesday, March 14th with his presentation: “A Decade of Data Center Efficiency: What’s Past is Prologue!” The lecture will cover data center electricity use, senior management, and how energy performance affects business performance. Vice President for Research at Binghamton University and Center Director of the Center for Energy-Smart Electric Systems (ES2), Sammakia will discuss bringing together workload allocation, thermal management, reliability and availability in a keynote presentation titled “A Holistic View of a Fragmented Data Center Industry” on Wednesday, March 15th.

“Future Facilities is proud to support a collaboration that’s fostering increased communication between currently integral but previously separate elements of data center performance at SEMI-THERM 33,” said Sherman Ikemoto, Director of Future Facilities NA. “The engineering impact of a data center’s operational environment is important to both IT thermal design and operations teams. This event presents an opportunity for both sides to understand how working together can make significant improvements on the performance of a data center.”

Future Facilities’ recent collaboration with ES2 modeled an example of thermal design and engineering simulation working together in a data center, demonstrating the kind of collaborative process emphasized by this track of sessions at SEMI-THERM.

About Future Facilities
For more than a decade, Future Facilities has provided engineering simulation software and consultancy services to the world’s largest data center owner-operators and the industry’s leading consultancies. With global offices, its software and services are relied on to deliver unique insight into the current and future performance of mission-critical data centers.

Additional information can be found at; follow us on Twitter @6SigmaDC.

SEMI-THERM is an international forum dedicated to the thermal management and characterization of electronic components and systems. It provides knowledge covering all thermal length scales from IC to facility level. The symposium fosters the exchange of knowledge between thermal engineers, professionals and leading experts from industry as well as the exchange of information on the latest academic and industrial advances in electronics thermal management.

Additional information can be found at


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