AUSTIN, Texas--(EON: Enhanced Online News)--The Silicon Integration Initiative (Si2) announced today their OpenPDK Coalition has released the Open Process Specification v1.1. The Open Process Specification (OPS), from Si2’s OpenPDK Coalition, contains all of the data elements that are necessary to automatically create a Process Design Kit (PDK) in any EDA vendor’s or company proprietary design flow. The OPS standard is a formal grammar based on the widely-used W3C standard XML Schema Definition (XSD). Now formally released, companies may freely integrate the various components of the standard for their own purposes.
“We are looking forward to future enhancements to achieve the goal of streamlining our extensive PDK development process to cut costs and speed production time. We believe that OPS will considerably enhance communication/data exchange between partners, foundries and EDA vendors.”
OPS v1.0 was targeted at process producing companies (Foundries), to enable study and creation of electronic versions of a Design Rule Manual (eDRM). Its first release was published in January 2013, to gather early feedback on completeness. Positive feedback and valuable suggestions have been rolled into version 1.1. OPS v1.1 is the first release targeted for consideration by EDA Vendors. It is complete enough to enable Design Rule Checks (DRC), parameter extraction including the Si2 Open parameter Extraction (OPEX) & technology file creation including the OpenAccess technology database.
OPS 1.1 new features include:
- Connectivity below Metal Layer One (M1, including local interconnect)
- Manufacturing, DRC & Layout Data Base (DB) grids
- Improved enumerations for layers and layer derivations
- Multi Patterning Support in Layers Definition for advanced node pattern generation
- Tool mapping / Interfaces (from the Si2 Tools Interface WG)
- A Metal Stack Connectivity Table than includes local interconnect usable by all tools
- A default set of Technology grid settings and optional sets of tool specific grid settings
- Multi Patterning Support added several “information attributes” in the OPS to support Multi Patterning: the “exposition Number”, the “mask Color” and the “lock Status”
- The OPS XSD provides an enumeration of the backward compatible versions it can be used with. An OPS instance selects the OPS XSD version with which it is compatible. This is part of the XSD validation capabilities of OPS
“STMicroelectronics has provided a complete example implementation (a full Design Rules Manual example and its complete translation in OPS.xml format) of the Open Process Specification to provide users the understanding of how to exploit the advantages of a single, formal, syntax for describing all of the information necessary to build a PDK,” says Gilles Namur, Advanced Process Design Kit Architect, STMicroelectronics. “We are looking forward to future enhancements to achieve the goal of streamlining our extensive PDK development process to cut costs and speed production time. We believe that OPS will considerably enhance communication/data exchange between partners, foundries and EDA vendors.”
OPS 1.1 and the example implementation is available at: http://www.si2.org/openeda.si2.org/project/showfiles.php?group_id=82&release_id=587
The goal of the OpenPDK Coalition is to define a set of open standards to define a PDK structure that will be as portable across foundries and as agnostic to EDA tools as possible. The OpenPDK from Si2 will enable greater efficiency in PDK development, verification and delivery and will provide equivalent support to all foundries, all EDA tool vendors, all IP providers, and all end users. The OpenPDK project aims to support all process nodes including high-voltage analog processes. For more information, see: http://www.si2.org/?page=1118
Membership in Si2 projects is open to all interested parties across the semiconductor supply chain. For more information see: http://www.si2.org/?page=1137
OpenPDK Member Companies
AnaGlobe Technology, Cadence Design Systems (NASDAQ: CDNS), GLOBALFOUNDRIES, IBM (NYSE: IBM), Intel (NASDAQ: INTC), Mentor Graphics (NASDAQ: MENT), NXP (NASDAQ: NXPI), Samsung Electronics (KSE: 005930), Silvaco, and STMicroelectronics (NYSE: STM).
Si2 is the largest organization of industry-leading semiconductor, systems, EDA and manufacturing companies focused on the development and adoption of standards to improve the way integrated circuits are designed and manufactured, in order to speed time-to market, reduce costs, and meet the challenges of sub-micron design. Now in its 25th year, Si2 is uniquely positioned to enable timely collaboration through dedicated staff and a strong implementation focus driven by its member companies. Si2 represents over 100 companies involved in all parts of the silicon supply chain throughout the world. See www.si2.org.