LISLE, Ill.--(BUSINESS WIRE)--Molex Incorporated has augmented its CPU solutions with the launch of an Intel-approved LGA 2011-0 CPU socket for the Intel Core* i7 series of 32nm-Sandy Bridge-E microprocessors. Designed to handle 130W Thermal Design Power (TDP), the LGA 2011-0 socket replaces the LGA 1366 CPU socket, which was used with the Intel Core i7-930, i7-950, i7-960, i7-980 and i7-990X processors.
“A higher pin-count and the greater contact density of the compact LGA 2011 socket make it ideal to support the condensed package—and powerful features of Intel 2nd generation, top-of-the-line Core i7 series processors in breakthrough performance applications.”
“The new LGA 2011-0 socket delivers the improved electrical, mechanical and thermal reliability needed to achieve target performance levels of Intel Core i7-3930K, i7-3820 and i7-3960K Extreme Edition processors used in enterprise servers, workstations and high-end PCs,” states Carol Liang, global product manager, Molex. “A higher pin-count and the greater contact density of the compact LGA 2011 socket make it ideal to support the condensed package—and powerful features of Intel 2nd generation, top-of-the-line Core i7 series processors in breakthrough performance applications.”
An innovative fully-loaded interstitial seating plane (ISP) design improves contact reliability of the Molex LGA 2011-0 socket by preventing circuit opens and shorts caused by contact deformation during a package overload. The LGA 2011-0 socket is compatible with a Standard (Square) and a Narrow ILM design assembly. The Standard ILM has a larger (80x80mm) keep-out zone than the Narrow ILM (56x94mm). The LGA 2011-0 socket is not backward compatible for use with any other processors and their ILM assemblies.
“The unique ISP design of the LGA 2011-0 socket minimizes risk of electrical shorting during processor overloads—protecting the investment of users who depend on higher system and operation reliability,” adds Liang.
The LGA 2011-0 CPU socket uses high strength, copper alloy contacts for robust performance. Socket terminals are oriented at angles that reduce the risk of cross-contact during processor overloads. Molex also offers 15 or 30 micron gold-plated contact sockets with pick-and-place covers for easy placement in automated board assembly. All sockets are shipped in JEDEC-type hard trays.
For additional information visit: www.molex.com/link/lga2011.html. To receive information on other Molex products and industry solutions, please sign up for our e-nouncement newsletter at http://www.molex.com/link/register/.
About Molex Incorporated
Providing more than connectors, Molex delivers complete interconnect solutions for a number of markets including data communications, telecommunications, consumer electronics, industrial, automotive, medical, military and lighting. Established in 1938, the company operates 40 manufacturing locations in 16 countries. The Molex website is http://www.molex.com. Follow us at http://www.twitter.com/molexconnectors watch our videos at http://www.youtube.com/molexconnectors, connect with us at http://www.facebook.com/molexconnectors and read our blog at http://www.connector.com.
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