LONDON--(EON: Enhanced Online News)--According to the latest market study released by Technavio, the global electronic adhesive market is expected to grow at a CAGR of more than 12% during the forecast period.
This research report titled ‘Global Electronic Adhesive Market 2016-2020’ provides an in-depth analysis of the market in terms of revenue and emerging market trends. This market research report also includes up to date analysis and forecasts for various market segments and all geographical regions.
The global electronic adhesive market was valued at USD 3.63 billion in 2015 and is expected to grow significantly during the forecast period. Increased utilization of electronic components, high demand for smart phones, the advent of IoT, combined with the decreasing cost for electronic components and the evolution of high density interconnect (HDI), will be the main factors fueling this impressive growth.
The rapidly increasing electronic components per automotive is an important driver of this market. Original equipment manufacturers are refining and adding enhanced safety, performance, stability, and comfort features to their conventional mechanical components. This is one of the important techniques which vendors use to gain an edge in this competitive market space. Advanced technologies utilize an increasing number of electronic components, mainly sensors, which will create new demand for electronic adhesives, thus driving the market forward.
Request a sample report: http://www.technavio.com/request-a-sample?report=54950
Technavio’s sample reports are free of charge and contain multiple sections of the report including the market size and forecast, drivers, challenges, trends, and more.
Based on product type, the report categorizes the global electronic adhesive market into the following segments:
- Electrically conductive adhesives
- Thermally conductive adhesives
- UV curing adhesives
- Other adhesives
The top three revenue generating product segments in the global electronic adhesive market are discussed below:
Electrically conductive adhesives
Talking about the need for conductive adhesives required in applications like integrated circuits (ICs) and surface mount devices (SMDs), Navin Rajendra, one of the lead market analysts at Technavio for semiconductor equipment research, says, “Conductive adhesives required for this market can be obtained by converting non-conductive adhesives by adding a suitable filler to the base material. Silver, nickel, and carbon are the important materials that are used as fillers to confer electrical conductivity to non-conductive regular adhesives. Conductive adhesives are either in the liquid form or pre-form, which are reinforced adhesive films die-cut before bonding to the shape required.”
Two main types of electrically conductive adhesives are isotropic and anisotropic adhesives. Isotropic adhesives are unidirectional, and conduct in the vertical plane only, while anisotropic adhesives conduct in all directions. However, electrically conductive adhesives are not suitable for all applications. For instance, they are not good with aluminum and tin (or tin-containing alloys), places where they are exposed to moist conditions, or where there are large gaps. Electrically conductive adhesives are estimated to showcase the highest growth during the forecast period with a CAGR of 13.28%.
Thermally conductive adhesives
With the miniaturization of electronic circuitry, problems of heat build-up are becoming more persistent. This will lead to the components exceeding their maximum operating temperature, resulting in early failure of electronic components. Thermally conductive adhesives can be used to offer a heat-conducting path, securing the diodes, transistors, and other power devices to suitable heat sinks, which ensures that such a heat build-up does not occur.
Electrically conductive metallic powders or insulating non-metallic powders are merged into adhesive preparation to make high-viscosity paste adhesives. These are extremely thermally conductive when compared with other unfilled adhesives. The most common thermally conductive systems are formulated with epoxies, silicones, and acrylics.
UV curing adhesives
“Light-curing adhesives are witnessing increased demands from the electronics manufacturing industry as they cater to the requirements of materials and processes within this industry. The major advantage for using UV curing adhesives is that they are environmentally friendly and do not use environmentally-damaging solvents and additives. Additionally, they provide manufacturing yield improvement and reduce product cost,” says Navin.
Light-curing adhesives are easy to use and are quickly cured at lower temperatures when compared to the other two types of adhesives discussed. They are usually acrylic-based formulations containing photo initiators. These photo initiators form free radicals to initiate the polymer-forming or curing process, when activated by ultraviolet radiation. One disadvantage of these adhesives is the UV light’s difficulty to penetrate the uncured resin. Deposits of resin that are inaccessible, dark-colored, or very thick are difficult to be cured efficiently.
The top vendors highlighted by Technavio’s research analysts in this report are:
- BASF SE
- Dow Chemical Company
- H.B. Fuller
- Henkel AG & Co KGaA
Browse Related Reports:
- Global Adhesives and Sealants Market 2016-2020
- Global Hot Melt Adhesives Market 2016-2020
- Global Magnetron Market 2016-2020
Do you need a report on a market in a specific geographical cluster or country but can’t find what you’re looking for? Don’t worry, Technavio also takes client requests. Please contact firstname.lastname@example.org with your requirements and our analysts will be happy to create a customized report just for you.
Technavio is a leading global technology research and advisory company. The company develops over 2000 pieces of research every year, covering more than 500 technologies across 80 countries. Technavio has about 300 analysts globally who specialize in customized consulting and business research assignments across the latest leading edge technologies.
Technavio analysts employ primary as well as secondary research techniques to ascertain the size and vendor landscape in a range of markets. Analysts obtain information using a combination of bottom-up and top-down approaches, besides using in-house market modeling tools and proprietary databases. They corroborate this data with the data obtained from various market participants and stakeholders across the value chain, including vendors, service providers, distributors, re-sellers, and end-users.
If you are interested in more information, please contact our media team at email@example.com.